: Developing Redistribution Layers in chips. Solder Bumping : Precise placement of micro-solder balls. 🚀 Advantages of this Method No Clogging : Uses larger nozzles to produce smaller drops. Contactless : Prints on uneven or fragile surfaces.
: Creates droplets far smaller than the nozzle itself.
: His work on high-speed EHD jetting.
: Works with conductive inks, polymers, and biomaterials. 🛠️ Key Applications
: Creating ultra-thin mesh for touchscreens. 2. Biomedical Engineering Jung_EHD
: Building 3D structures for tissue growth. Drug Delivery : Micro-patterning medication on patches. 3. Semiconductor Packaging